Super Thermal Resistant Polyimide Shape Antistatic Grade
Polyimide Shape is used widely in semiconductor device and manufacturing equipment parts of many other electronic devices. When used as the manufacturing equipment parts, the electrostatic discharge may occur depending on the application. To prevent the electrostatic hazard, we have developed the antistatic polyimide shape, CEPLA SA101-D
CEPLA SA101D Super High Heat-Resistant Polyimide Resin Antistatic Grade Properties of CEPLA SA101D (Standard Size : 150□x40t 150□x50t)
Property |
Item |
Unit |
Test Method ASTM |
Testing Temperature |
CEPLA SA101D |
General Properties |
Component |
-- |
-- |
-- |
BPDA Polyimide |
Relative Density |
-- |
D-792 |
23ºc |
1.46 |
Absorption |
% |
D-570 |
23ºc |
0.06(24h) |
Mechanical Properties |
Tensile Strength |
MPa |
D-638 |
23ºc |
61 |
260ºc |
43 |
Elongation |
% |
D-638 |
23ºc |
0.65 |
260ºc |
0.98 |
Flexural Strength |
MPa |
D-790 |
23ºc |
95 |
260ºc |
49 |
Flexural Modulus |
GPa |
D-790 |
23ºc |
6.8 |
260ºc |
3.6 |
Compressive Stress (1% distortion) |
MPa |
D-695 |
23ºc |
66 |
Compressive Elasticity Modulus |
GPa |
D-695 |
23ºc |
6.98 |
Izod Impact Strength (Notched) |
J/Min |
D-256 |
23ºc |
13.0 |
Rockwell Hardness |
M-Scale |
D-785 |
23ºc |
117 |
Thermal
Properties |
Heat Distortion Temperature (18.56kgf/cm²) |
ºc |
D-648 |
-- |
470 |
Coefficient of Linear Thermal Expansion |
Ppm/ºc |
E-233 |
-- |
34.2
(20~450ºc) |
Electrical Properties |
Volume Resistivity |
Ω-cm |
D-257 |
23ºc |
1.4X103 |
Surface Resistivity |
Ω |
D-257 |
23ºc |
4.5X104 |
|